{"id":4712,"date":"2024-03-01T15:07:01","date_gmt":"2024-03-01T06:07:01","guid":{"rendered":"https:\/\/www.dry-fog.com\/en\/?post_type=technical-report&p=4712"},"modified":"2024-11-12T12:14:44","modified_gmt":"2024-11-12T03:14:44","slug":"hum-smt-002","status":"publish","type":"technical-report","link":"https:\/\/www.dry-fog.com\/en\/projects-technology\/technical-report\/hum-smt-002\/","title":{"rendered":"Preventing ESD Damage in SMT | 7 Benefits of Dry Fog Humidification (Part 2)"},"content":{"rendered":"
Table of Contents<\/div>\n
    \n
  1. Preventing ESD damage (Jump to Part 1)<\/a><\/li>\n
  2. Reducing pick-and-place errors (Jump to Part 1)<\/a><\/li>\n
  3. Maintaining consistent solder print quality<\/a><\/li>\n
  4. Reducing airborne particles<\/a><\/li>\n
  5. Significant reduction in operating costs (Jump to Part 3)<\/a><\/li>\n
  6. Reducing cooling costs (Jump to Part 3)<\/a><\/li>\n
  7. Less sick leave (Jump to Part 3)<\/a><\/li>\n
  8. Download | 7 benefits of Dry Fog Humidification in SMT processes<\/a><\/li>\n<\/ol>\n

    \"\u30a8\u30ec\u30af\u30c8\u30ed\u30cb\u30af\u30b9\u3000\u8868\u9762\u5b9f\u88c5\u3000\u52a0\u6e7f\"<\/p>\n

    7 benefits of Dry Fog Humidification in SMT processes<\/h3>\n

    In surface-mount technology (SMT) processes, humidity control is essential to prevent electrostatic discharge (ESD) damage and problems with static electricity or dry air. Among all the methods to control humidity, the Dry Fog* Humidification system from IKEUCHI is the only one able to achieve all seven of these benefits.<\/p>\n

    *A fog formed out of ultrafine water droplets, each measuring 10 \u03bcm or less in diameter, which are created by specialized spray nozzles, to instantly evaporate into the air or bounce off any object instead of bursting on impact.<\/p>\n

    1. Preventing ESD damage
    \n2. Reducing pick-and-place errors
    \n3. Maintaining consistent solder print quality<\/span>
    \n4. Reducing airborne particles<\/span>
    \n5. Significant reduction in operating costs
    \n6. Reducing cooling costs
    \n7. Less sick leave<\/p>\n

    In this article the main focus is on solder printing and airborne particles, in the table of contents under 3 and 4. The benefits of 1 and 2 were discussed in the previous article.<\/span><\/a><\/p>\n

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